intersil的Digital-DC™ 产品的布局指南

intersil的Digital-DC™ 产品的布局指南
Thermal and Layout Guidelines for Digital-DC Products


Application Note May 01, 2009 AN2010.0



Introduction
This application note provides guidance on the thermal per side and a central exposed leadframe paddle used
considerations and preferred layout practices for using to mount die and connect the signal ground (SGND).
Zilker Labs’ Digital-DC power management and This central paddle allows heat generated within the
conversion ICs. Intended applications for these parts part to be dissipated into the printed circuit board
are primarily synchronous buck embedded re