资料介绍
無鉛制程
6
1.PCB 2. 3. 4. 5. 6.
1. PCB
PCB :
a. (Electrolytic Ni/Au) b. OSP (Organic Solderability Preservatives) c. (Immersion Ag d. (Electroless Ni/Au, ENIG) e. (Immersion Tin) f. (SAC HASL)
a.
b. OSP
pad dip dip
c.
OSP
d.
HP Dell !
(Black Pad) HP
2.
SMT 260
3.
a. SMT b. Dip c. Rework
a. SMT
SMT 8 Reflow 8 profile /sec ! 2 /sec reflow
63/37
b. Dip
63/37 30~40 260-270 ! ( 270-280 )
c. Rework
30~40 30 350~380 420~450
80
4.
:
a. b. c.
a.
(Sn96.5/Ag3.5
, ! ! Sn/Pb
221 )
b.
(Sn99.3/Cu0.7
227 )
NEMI ,
(270~280 ) Ni
(
0.1%)
c.
Sn/Ag3~4%/Cu0.5~1 219 )
(1) NEMI ----(Sn95.5/Ag3.9/Cu0.6) (2) JEIDA ----(Sn96.5/Ag3.0/Cu0.5) (3) ---(Sn96.5/Ag3.8/Cu0.7
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