MCP datasheet: H9DP32A4JJMCGR

H9DP32A4JJMCGRCI-MCP Specification 4GB e-NAND Flash + 4Gb Mobile DDR

This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.1 / Apr. 2011 1

Preliminary H9DP32A4JJMCGR series e-NAND 4GB(x8) / Mobile DDR 4Gb(x32 2CS)

Document Title CI-MCP 4GB(x8) e-NAND / 4Gb (64Mb x32 2/CS 2CKE) Mobile DDR Revision History
Revision No.
0.1

History
Initial Draft - 4GB e-NAND Flash F-Die - 2Gb mobile DDR A-Die

Draft Date
Apr. 2011

Remark
Preliminary

Rev 0.1 / Apr. 2011

2

Preliminary H9DP32A4JJMCGR series e-NAND 4GB(x8) / Mobile DDR 4Gb(x32 2CS)

FEATURES
[ CI-MCP ] ● Operation Temperature - -25oC ~ 85oC ● Packcage - 153-ball FBGA - 11.5x13mm2, 1.0t, 0.5mm pitch - Lead & H