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H9TP32A8JDMCPR_Series_(Rev0CI-MCP Specification 4GB eNAND (x8, MMC) + 8Gb LPDDR2-S4B (x32, 2CS)

This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.1 / Mar. 2012 1

Preliminary H9TP32A8JDMCPR series 4GB eNAND (x8,MMC) / LPDDR2-S4B 8Gb(x32,2CS) Document Title CI-MCP 4GB (x8, MMC) e-NAND / 8Gb (x32, 2CS) LPDDR2-S4B Revision History
Revision No.
0.1

History
Initial Draft - 4GB e-NAND - 8Gb(2*4Gb LPDDR2 M-Die) LPDDR2

Draft Date
Mar. 2012

Remark
Preliminary

Rev 0.1 / Mar. 2012

2

Preliminary H9TP32A8JDMCPR series 4GB eNAND (x8,MMC) / LPDDR2-S4B 8Gb(x32,2CS) FEATURES
[ CI-MCP ] ● Operation Temperature - 25oC ~ 85oC ● Package - 162-ball FBGA - 11.5x13mm2, 1.0t, 0.5mm pitc