高度集成的前端多芯片模块

泰克在DPO/DSA70000D系列示波器采用定制设计、高度集成的前端多芯片模块(MCM)
Inside the DPO/DSA70000D Series
The custom, Multi-Chip Module (MCM) ensures high-speed signals
never touch the PCB before they are sampled.
With technological advancement maintaining the rapid pace of Moore’s Law*1, test and measurement tasks are becoming
increasingly difficult. High-performance applications, especially those requiring silicon characterization, serial data
compliance, optical modulation analysis, double data rate (DDR) memory and wideband RF verification, demand test and
measurement capabilities that were previously unattainable. This includes a combination of exceptional performance
(bandwidth and sample rate) and flexibility (termination voltage and sensitivity), without negatively impacting signal fidelity.

The Tektronix DPO/DSA70000D Series oscilloscope