intersil的F18.3 — Mil-Std-1835 GDIP1-T18(D-6,Config A)18 脚陶瓷双列直插式封装（CERDIP）

F18.3 — Mil-Std-1835 GDIP1-T18(D-6,Config A)18 Lead Ceramic Dual-In-Line Frit Seal PKG
Hermetic Packages for Integrated Circuits

Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
c1 LEAD FINISH F18.3 MIL-STD-1835 GDIP1-T18 (D-6, CONFIGURATION A)
-A- -D- 18 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE

BASE INCHES MILLIMETERS
(c)
METAL
E SYMBOL MIN MAX