intersil的W2X2.4 — 2x2阵列4球晶圆级芯片规模封装（WLCSP）

W2X2.4 — 2x2 Array 4 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch)
Plastic Packages for Integrated Circuits

Wafer Level Chip Scale Package W2x2.4
(WLCSP 0.4mm Ball Pitch) 2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL MILLIMETERS
D
A 0.44 Min, 0.495 Nom, 0.55 Max
A1 0.190 ±0.030
A2 0.305 ±0.025
E