intersil的M24.173B — 24铅细收缩轮廓封装（TSSOP）

M24.173B — 24 Lead Thin Shrink Small Outline Plastic Package
Plastic Packages for Integrated Circuits

Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)

N M24.173B
24 LEAD THIN SHRINK SMALL OUTLINE EXPOSED PAD
INDEX 0.25(0.010) M B M
AREA E PLASTIC PACKAGE
E1
GAUGE INCHES MILLIMETERS
-B- PLANE