intersil的M16.173 — 16铅细收缩轮廓封装（TSSOP）

M16.173 — 16 Lead Thin Shrink Small Outline Plastic Package
Plastic Packages for Integrated Circuits

Package Outline Drawing
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
A
1 3
5.00 ±0.10

16 9 SEE DETAIL "X"




6.40
PIN #1
4.40 ±0.10 I.D. MARK
2 3




0.20 C B A 1 8