intersil的M14.173B — 14铅细收缩轮廓封装（HTSSOP）

M14.173B — 14 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)
Plastic Packages for Integrated Circuits

Package Outline Drawing
M14.173B
14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 1, 1/10

A
1 3
5.00 ±0.10 3.10 ±0.10

14 8 SEE
DETAIL "X"




6.40
PIN #1
4.40 ±0.10 I.D.