intersil的M14.173 — 14铅细收缩轮廓封装（TSSOP）

M14.173 — 14 Lead Thin Shrink Small Outline Package
Plastic Packages for Integrated Circuits

Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
A
1 3
5.00 ±0.10

14 8 SEE
DETAIL "X"




6.40
PIN #1
4.40 ±0.10 I.D. MARK
2 3




0.20 C B A