首页|嵌入式系统|显示技术|模拟IC/电源|元件与制造|其他IC/制程|消费类电子|无线/通信|汽车电子|工业控制|医疗电子|测试测量
首页 > 分享下载 > 嵌入式系统 > intersil的L12.3X3Z — 12 铅薄四平(TQFN)封装

intersil的L12.3X3Z — 12 铅薄四平(TQFN)封装

资料介绍
L12.3X3Z — 12 Lead Thin Quad Flat No Lead Plastic Package ***For ISL99202 USE ONLY***
Plastic Packages for Integrated Circuits

Package Outline Drawing
L12.3x3Z
12 LEAD THIN QUAD FLAT NO LEAD PLASTIC PACKAGE
FOR ISL99202 USE ONLY WITH REDUCED e-PAD SIZE TO 1.4mm ON LAND PATTERN
Rev 0, 10/08
3.00 A 0.5
BSC 6
B
10 12 PIN #1 INDEX AREA

6
PI
标签:intersilTQFN
intersil的L12.3X3Z — 12 铅薄四平(TQFN)封装
本地下载

评论