intersil的M28.209 — 28铅收缩塑料包小轮廓（SSOP）封装

M28.209 — 28 Lead Shrink Small Outline Plastic Package
Plastic Packages for Integrated Circuits

Shrink Small Outline Plastic Packages (SSOP)

N M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA H 0.25(0.010) M B M
INCHES MILLIMETERS
E
GAUGE SYMBOL MIN MAX MIN MAX NOTES
-B-