V144.7X7A — 144铅薄 TFBGA 封装

intersil产品的V144.7X7A — 144铅薄 TFBGA 封装信息。
Status of Document is: RELEASED Effective from: 2011-01-14 18:48:54 EST to

Controlled Document

Package Outline Drawing
V144.7X7A
144 Lead Thin, Fine Pitch Plastic ball Grid Array Package (TFBGA)
Rev 0, 1/11




TOP VIEW BOTTOM VIEW


0.05 M C
A1 CORNER 0.15 M C AB A1 CORNER
0.27~0.37
1 2 3 4 5 6 7 8 9 10 11 12


A