infineon MOSFETS TO封装尺寸

infineon MOSFETS TO封装尺寸
Additional Information, DS1, March 2008




Recommendations for Assembly
of Infineon TO Packages
Edition 2008-03
Published by
Infineon Technologies AG
81726 München, Germany
2008 Infineon Technologies AG
All Rights Reserved.

Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.

Information
For further information on technology, delivery terms and co