资料介绍
无铅化封装回流焊实现 Application Note: Packaging
R Implementation and Solder Reflow
Guidelines for Pb-Free Packages
Author: Mj Lee
XAPP427 (v2.5) February 4, 2010
Summary Recent legislative directives and corporate driven initiatives around the world have called for
the elimination of Pb and other hazardous substances in electronics used in many sectors of
the electronics industry. The Pb-free
我要上传