第一个无铅侧边焊封装

第一个无铅侧边焊封装SOD882D
The first leadless package
with solderable side pads


Solderable (Tin-plated) exposed side pads
Easy visible inspection of solder pads
Very high mechanical robustness




0.37 mm
Post-soldering stability


mm
0.6 1.0
mm
inch: 0402 package

Full thermal, electrical,
mounting and footprint
compatibility to leadless
1006 mm packages (inch: 0402)
Height only 0.37 mm




Built for a range of functions
P rotection, Switching and Schottky diodes
Ideal for sma