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恩智浦SOD882D封装

资料介绍
降低高度和创新焊盘设计
NXP SOD882D package
with reduced height and
innovative pad design




First leadless package with tin-plated,
solderable side pads
This new, ultra-small leadless plastic package is the industry’s first to offer solderable side pads. `
It measures only 1.0 x 0.6 x 0.37 mm and delivers very high mechanical stability.


Key features Key applications
`` Solderable side pads `` Highly space-constrained devices
`` Low package height of 0.37 mm `` Mobile phones
`` AEC-Q101 qualified
标签:NXPSOD882D
恩智浦SOD882D封装
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