有关MLFP封装的RSLIC18热特性和板水平模型

Thermal Characterization and Board Level Modeling of the RSLIC18 in the MLFP Package
Thermal Characterization and Board Level Modeling
TM
of the RSLIC18 in the MLFP Package
Application Note October 2001 AN9922
Author: Doug Bruss


Introduction
In most circuit designs real- The Concept of Thermal Resistance
estate is a premium. This is
The term