无铅元器件表面处理的货架寿命评估

无铅元器件表面处理的货架寿命评估

Application Report
SZZA046 - June 2004




Shelf-Life Evaluation of Lead-Free Component Finishes
Douglas W. Romm, Donald C. Abbott, and Bernhard Lange

ABSTRACT

The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for
leadframe-based packages. IC component users need to know the maximum length of time
that components can be stored prior to being soldered. This study predic