首页|嵌入式系统|显示技术|模拟IC/电源|元件与制造|其他IC/制程|消费类电子|无线/通信|汽车电子|工业控制|医疗电子|测试测量
首页 > 分享下载 > 嵌入式系统 > 对于ODFN封装的表贴器件装配的指南

对于ODFN封装的表贴器件装配的指南

资料介绍
对于ODFN封装的表贴器件装配的指南

Surface Mount Assembly Guidelines for Optical
Dual FlatPack No Lead (ODFN) Package
Technical Brief March 14, 2008 TB466.1



Introduction Part I - ODFN Board Mounting Guidelines
Optical Dual-in-line Flat No-lead (ODFN) packages are The ODFN package board mounting process is similar to
developed for light sensor applications. The mechanical that of conventional DFN/QFN packages. However, there
structure of an ODFN is similar to that of a conventional
标签:intersilODFN封装
对于ODFN封装的表贴器件装配的指南
本地下载

评论