有关集成电路中的磁带和卷规范

Tape and Reel Specification for Integrated Circuits
Technical Brief 347
Author: Laszlo Nemeth


Tape and Reel Specification for Integrated Circuits
Introduction
Many surface mounted devices (SMD) are being packaged for
shipment in embossed tape and wound onto reels. The
Intersil Tape and Reel specifications are in compliance with
Electronics Industries Association Standards for “Embossed
Carrier Taping of Surface Mount Components for Automatic
Handling”.
EIA-481 for the . . . . . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and