PCBLayout精华

LAYOUT REPORT .................................................................................................................. 1
目.......................................................................................................................................... 1
1. PCB LAYOUT gZ解(TERMS)......................................................................................... 2
2. Test Point : ATE yc供工SICT y治具使用.................................................... 2
3. 基庶c (光Wc) -for SMD:........................................................................................... 4
4. 擞 (LABEL ING)............................................................................................................. 5
5. VIA HOLE PAD..................................................................................................................... 5
6. PCB Layer 排列方式.......................................................................................................... 5
7.零件阎米⒁馐马 (PLACEMENT NOTES)........................................................................... 5
8. PCB LAYOUT O................................................................................................................ 6
9. Transmission Line ( 鬏 )..................................................................................... 8
10.General Guidelines C 跨Plane.................................................................................. 8
11. General Guidelines C @....................................................................................... 9
12. General Guidelines C Damping Resistor............................................................. 10
13. General Guidelines - RJ45 to Transformer......................................................... 10
14. Clock Routing Guideline........................................................................................... 12
15. OSC CRYSTAL Guideline........................................................................................... 12
16. CPU #1048782; RAM#1048782;FLASH.................................................................................................... 14
17. General Guidelines CDecoupling Capacitor..................................................... 14
18.POWER 部分........................................................................................................................ 15
19. GND Vcc Plan 切割................................................................................................... 17
20. DRC : Design Rule Check........................................................................................... 19
21. CAM 出/出文件(⒖gerber file 流程D)........................................................ 20
22. 其他注意事................................................................................................................. 21
23.PCB u作填注意事............................................................................................ 23