资料介绍
国半的资料，目录如下：1. Course Navigation
1. 1.1 Course Navigation
2. 1.2 Course Objectives
3. 1.3 Importance
2. High di/dt Loops
1. 2.1 What is the di/dt Problem?
2. 2.2 Locating di/dt Loops
3. 2.3 High di/dt Fix
4. 2.4 Low-Side FET Grounding
3. Grounding
1. 3.1 Varga's Ground Rules
2. 3.2 Dutra's Ground Rules
3. 3.3 Additional Ground Rules
4. High Current Copper Requirements
1. 4.1 Copper Trace Width Formula
2. 4.2 Copper Trace Width Examples
3. 4.3 Via Considerations
4. 4.4 Alley Ways Between Vias
5. Layer Stackup and Bypass Caps
1. 5.1 Layer Stackup
2. 5.2 High Frequency Bypass Caps
3. 5.3 Output Bypass Caps
4. 5.4 Output Capacitors Summary
6. Component Layout
1. 6.1 Component Placement Strategy 1
2. 6.2 Component Placement Strategy 2
3. 6.3 Rules of Thumb
4. 6.4 Gate Drive Layout
5. 6.5 Power FETs and Decoupling
6. 6.6 Switch Node
7. 6.7 Clean Layout - Two Sided
8. 6.8 Clean Layout - Single Sided
9. 6.9 Synchronous Buck FET Layout
10. 6.10 Control Circuit Layout - 1
11. 6.11 Control Circuit Layout - 2
12. 6.12 Thermal Considerations
7. Probing Techniques
1. 7.1 Magnetic Probes
2. 7.2 Source Terminated Probe
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