资料介绍
各种IC封装形式各 种 IC 封 装 形 式 文 章 来 源 ： http://www.weierda.cn/icpacking.asp
BGA Ball Grid Array
EBGA 680L
PBGA 217L LBGA 160L Plastic Ball Grid Array
SBGA 192L
TSBGA 680L
CNR Communication CLCC and Networking Riser Specification Revision 1.2
CPGA Ceramic Pin Grid Array
DIP Dual Inline Package
DIP-tab Dual Inline Package with Metal Heatsink FBGA
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FDIP
FTO-220
Flat Pack
HSOP-28
ITO-220
ITO-3P
JLCC
LCC
LDCC
LGA
LQFP
PCDIP
PGA Plastic Pin Grid Array
PLCC
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PQFP
PSDIP
LQFP 100L
METAL QUAD 100L
PQFP 100L
QFP Quad Flat Package
SOT143
SOT220
SOT223
SOT223
SOT23
SOT23/SOT323
SOT25/SOT353
SOT26/SOT363
SOT343
SOT523
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