AW-GH320-DataSheet-Rev1.3

AW-GH320-DataSheet-Rev1AW-GH320
IEEE 802.11 b/g Wireless LAN Module IC
For Mobile Phones, DSCs, PMPs and Gaming Devices

Datasheet
Version 1.3
Document release
Version 0.6

Date

Modification
1. Add some pin description of the pin 33 and 39 at P13 2. Add note about the reflow temperature at P25 3. Change module high to 1.4mm 1.Improve the customer product yield AW-GH320 Top View PCB Layout at p24 2. Modify operating Temperature 1.Imporve Rx Sensitivity 2. Some system VIO_X2 use 3.3V stable than 1.8V Ervise Top View PCB Layout footprint at P24 1.Add Reliability test and Certification test 2.Modified reflow profile time Modify the pad size to improve the customer’s SMT yield Modify Power manager define and add SMT preparation 1.Add Japan ch14 target power 2. Update operating temperature

Initials

Approved

2006/1