intersil的S3X3.9 — 3x3 的OCSP封装信息

intersil的S3X3.9 — 3x3 的OCSP封装信息
Plastic Packages for Integrated Circuits

Package Outline Drawing
S3x3.9
3X3 ARRAY 9 BUMP OPTICAL CHIP SCALE PACKAGE (OCSP)
Rev 7, 10/10
A1
CORNER
2.155 ±0.025 A 1.30


B 0.65

A1