资料介绍
SMT 封装返工 White Paper: Xilinx FPGAs
R
WP192 (v1.0) May 12, 2003
SMT Package Rework
By: Quang (Peter) Nguyen
Surface Mount Technology (SMT) packages include the
leaded family packages (Quad Flat Pack (QFP) and Plastic
Leaded Chip Carrier (PLCC)) and the Ball Grid Array
(BGA) packages. SMT rework can be necessary for any of
the following reasons: assembly re
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