XAPP427 - Implementation and Solder Reflow Guidelines for Pb-Free Packages(

XAPP427 - Implementation and Solder Reflow Guidelines for Pb-Free Packages
Application Note: Packaging

R Implementation and Solder Reflow
Guidelines for Pb-Free Packages
Author: Mj Lee
XAPP427 (v2.5) February 4, 2010


Summary Recent legislative directives and corporate driven initiatives around the world have called for
the elimination of Pb and other hazardous substances in electronics used in many sectors of
the electronics industry. The Pb-free