资料介绍
2045-PB01-RBCM2045
BLUTONIUM BLUETOOTH 2.0 + EDR SINGLE-CHIP HCI SOLUTION
FEATURES World’s first Bluetooth 2.0 + EDR solution in 0.13 um CMOS
technology Fully integrated balun and T/R switch eliminates all external RF matching components Supports class 1, 2, and 3 designs
SUMMARY OF BENEFITS Maximizes range and simplifies system integration by
providing exceptional output power and receiver sensitivity High-level of integration eliminates challenges of board level RF design Achieves smallest board area requirements by minimal external BOM and smallest package size available today Standard PCB requirement is less than 50 mm^2 Module solutions less than 25 mm^2 ROM-based solution with flexible code patching ensures fast integration On-chip voltage regulator lowers BOM requirements and provid
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