积分:0分 关键词:Altera,hermal management, heat, heat dissipation, thermal resistance, thermal interface material, TIM, heat sink, heat sink calculation, attachment method, tipping, tilting, lidless package, device package
积分:0分 关键词:Quad Flat ,Package (QFP)
积分:0分 关键词:Maxim,1-wire, master, slave, ibutton, parasitic supply, package, sfn, flip chip, ucsp, identification, control, temperature, time, nv sram, otp eprom, eeprom, secure eeprom, logging, evaluation kit, ev kit, customization