积分:0分 关键词:Maxim,noise decoupling, capacitor, self resonance star, ground filter, RC, LC, resistor, inductor, voltage reference, LDO, LNA, analog, interface, crosstalk, linearity, system on a chip, safety, op amps, ground planes, power, busses, sensor conditioning
积分:0分 关键词:Maxim,single-phase power management, AC-power measurement, single-phase energy measurement, calibration, precision power meter, system-on-chip, SoC, Teridian
积分:0分 关键词:Maxim, single-phase power management, AC power measurement, Teridian, system-on-chip, SoC, AC load
积分:0分 关键词:Maxim,single-phase power management, single-phase energy measurement, AC power measurement, SoC, system-on-chip, Teridian
积分:0分 关键词:Maxim,mart card reader, system-on-chip, CCID, chip/smart card reader interface device, SoC, USB, Teridian
积分:0分 关键词:Maxim,smart card reader, system-on-chip, SoC, CCID, chip/smart card interface device, ISO 7816, Teridian
积分:0分 关键词:Maxim,T1, E1, T1/E1, 8MHz, backplane, PCM, pulse code modulation, elastic store, DS0, 2.048MHz, system clock, framer, byte interleaved, IBO, interleave bus operation, SCTs, single chip transceivers, stream
积分:0分 关键词:Maxim,multiplex, backplane, framers, clock operation, T1 controller, single chip transceiver, SCT, E1 framer, T1 framer
积分:0分 关键词:Maxim, interface, non-multiplexed, port, SCTs, single chip transceivers
积分:0分 关键词:Maxim,PMC-Sierra, PM7345, Utopia, T1, E1, T1/E1, single chip transceiver, SCT
积分:0分 关键词:Maxim, single chip transceiver, E1 line, resistors, transformersingle chip transceivers, SCTs, transformers
积分:0分 关键词:Maxim,IGT, integrated telecom technology, SAR, segmentation and reassembly, DS1, T1, E1, SCT, single chip transceiver
积分:0分 关键词:Maxim,framers, SCTs, single chip transceiver, ETSI, ETS 300-011, remote alarm, framer, tranceiver, SCT, E1 framers
积分:0分 关键词:Maxim,T1, E1, T1/E1, 8MHz, backplane, PCM, pulse code modulation, elastic store, DS0, 2.048MHz, system clock, framer, byte interleaved, IBO, interleave bus operation, SCTs, single chip transceiver, stream
积分:0分 关键词:Altera,reliability test, thermal adhesive, heat sink attachment, thermal interface, compression, coplanarity, FCBGA, flip chip ball-grid array