积分:0分 关键词:Maxim,Theta JA, Theta JC, theta-ja, theta-jc, self heating, thermal dissipation, heat dissipation, power dissipation, thermal resistance, junction to case, junction to ambient, temperature, sensor, temperature sensor, thermal
积分:0分 关键词:Maxim,single cell, li+, li-ion battery charger, lossless charger, no heat charger, pulse charger, charging, lithium-ion
积分:0分 关键词:Altera,hermal management, heat, heat dissipation, thermal resistance, thermal interface material, TIM, heat sink, heat sink calculation, attachment method, tipping, tilting, lidless package, device package
积分:0分 关键词:Altera,reliability test, thermal adhesive, heat sink attachment, thermal interface, compression, coplanarity, FCBGA, flip chip ball-grid array
积分:0分 关键词:Linear,LTC3731,200A,Heat Sinks
积分:0分 关键词:Maxim,Theta JA, Theta JC, theta-ja, theta-jc, self heating, thermal dissipation, heat dissipation, power dissipation, thermal resistance, junction to case, junction to ambient, temperature, sensor, temperature sensor, thermal