积分:0分 关键词:Altera,hermal management, heat, heat dissipation, thermal resistance, thermal interface material, TIM, heat sink, heat sink calculation, attachment method, tipping, tilting, lidless package, device package
积分:0分 关键词:Altera,reliability test, thermal adhesive, heat sink attachment, thermal interface, compression, coplanarity, FCBGA, flip chip ball-grid array
积分:0分 关键词:USB设计,download Attachment