积分:0分 关键词:Maxim,倒装, 芯片, 芯片级, 晶片, 级, 封装, wlp, uCSP, 倒装芯片, wlcsp, 无铅, rohs, 顶标, 焊球, 裸片
积分:0分 关键词:Maxim,1-wire, master, slave, ibutton, parasitic supply, package, sfn, flip chip, ucsp, identification, control, temperature, time, nv sram, otp eprom, eeprom, secure eeprom, logging, evaluation kit, ev kit, customization