资料介绍
THGBM2G7D4FBAI9 32nm 16GB e-MMC_E_rev0Preliminary
THGBM2G7D4FBAI9
TOSHIBA e-MMC Module
16GB THGBM2G7D4FBAI9 INTRODUCTION
THGBM2G7D4FBAI9 is 16-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM2G7D4FBAI9 has an industry standard MMC protocol for easy use.
FEATURES
THGBM2G7D4FBAI9 Interface
THGBM2G7D4FBAI9 has the JEDEC/MMCA Version 4.4 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Pin Connection
P-TFBGA169-1216-0.50A4 (12 x 16mm, H1.2mm max. package)
14 13 12 11 10 9 8 7 6 5 4 3 2 1
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