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东芝EMMC 资料

资料介绍
THGBM2G6D2FBAI9 32nm 8GB e-MMC_E_rev0Preliminary

THGBM2G6D2FBAI9
TOSHIBA e-MMC Module

8GB THGBM2G6D2FBAI9 INTRODUCTION
THGBM2G6D2FBAI9 is 8-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM2G6D2FBAI9 has an industry standard MMC protocol for easy use.

FEATURES
THGBM2G6D2FBAI9 Interface
THGBM2G6D2FBAI9 has the JEDEC/MMCA Version 4.4 interface with either 1-I/O, 4-I/O and 8-I/O mode support.

Pin Connection
P-TFBGA169-1216-0.50A4 (12 x 16mm, H1.2mm max. package)

14 13 12 11 10 9 8 7 6 5 4 3 2 1
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东芝EMMC 资料
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