资料介绍
ic成分Article- Article/Part Name No. / MaterialNo.
Level
Quantity
Component of Assembled Part
Mass [g]
Level
Material / Producer Mass [g] related Product Name
Amount [%]
Substances CASNo.
Basic substances name
Amount [%]
1 1 1
silicon glue epoxy resin IC(integrate circuit)
0.0046 0.1245 0.0095
868-77-9 25928-94-3 7440-21-3 7429-90-5 7440-57-5
2-Hydroxyethyl methacrylate Diethylene-glycol,-polymer-with-1chloro-2,3-epoxypropane Silicon Aluminium (metal) Gold Copper
100 100 90.47619 0.547619 8.97619 23.41129
1
FPC
0.1037
7440-50-8
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