首页|嵌入式系统|显示技术|模拟IC/电源|元件与制造|其他IC/制程|消费类电子|无线/通信|汽车电子|工业控制|医疗电子|测试测量
首页 > 分享下载 > 嵌入式系统 > 温度传感器和1-Wire器件封装的热电阻值(的Theta JA ,θ JC )

温度传感器和1-Wire器件封装的热电阻值(的Theta JA ,θ JC )

资料介绍
摘要:两种常见的IC封装热阻的测量值是结到环境(的Theta JA )和结点到外壳(西塔赛马) 。这些参数计算最大功耗和自发热,和封装类型比较有用的。选择Maxim的温度传感器和1-Wire ®器件的Theta JA和Theta赛马值这里介绍。计算值的例子。

Maxim > Design Support > Technical Documents > Application Notes > 1-Wire Devices > APP 3930
Maxim > Design Support > Technical Documents > Application Notes > General Engineering Topics > APP 3930
Maxim > Design Support > Technical Documents > Application Notes > Measurement Circuits > APP 3930

Keywords: Theta JA, Theta JC, theta-ja, theta-jc, self heating, thermal dissipation, heat dissipation, power dissipation, thermal resistance, junction to case,
junction to ambient, temperature, sensor, temperature sensor, thermal
Nov 16, 2006
APPLICATION NOTE 3930

Package Thermal Resistance Values (Theta JA, Theta JC) for
Temperature Sensors and 1-W
标签:MaximThetaJAThetaJCtheta-jatheta-jcselfheatingthermaldissipationheatdissipationpowerdissipationthermalresistancejunctiontocasejunctiontoambienttemperaturesensortemperaturesensorthermal
温度传感器和1-Wire器件封装的热电阻值(的Theta JA ,θ JC )
本地下载

评论