资料介绍
保质期评价无铅组件完成
Application Report
SZZA046 - June 2004
Shelf-Life Evaluation of Lead-Free Component Finishes
Douglas W. Romm, Donald C. Abbott, and Bernhard Lange
ABSTRACT
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for
leadframe-based packages. IC component users need to know the maximum length of time
that components can be stored prior to being soldered. This study predic