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保质期评价无铅组件完成

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保质期评价无铅组件完成

Application Report
SZZA046 - June 2004




Shelf-Life Evaluation of Lead-Free Component Finishes
Douglas W. Romm, Donald C. Abbott, and Bernhard Lange

ABSTRACT

The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for
leadframe-based packages. IC component users need to know the maximum length of time
that components can be stored prior to being soldered. This study predic
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