首页|嵌入式系统|显示技术|模拟IC/电源|元件与制造|其他IC/制程|消费类电子|无线/通信|汽车电子|工业控制|医疗电子|测试测量
首页 > 分享下载 > 工业控制 > infineon IGBT电源循环测试

infineon IGBT电源循环测试

资料介绍
infineon IGBT电源循环测试
Reliability of Substrate Solder Joints from Power Cycling Tests
Thomas Hunger, Infineon Technologies AG, Warstein, Germany
Reinhold Bayerer, Infineon Technologies AG, Warstein, Germany




Abstract
The lifetime of the solder joint between base plate and ceramic substrate is usually tested by passively
heating and cooling the IGBT module (thermal cycling). This provokes failures (delamination) in that
solder layer. But, the IGBT and diode dies are actively heated in the application. Other failure modes
(e.g. bond wire lift off) are addressed and limit the lifetime. This kind of stress is usually tested via
power cycling. In the present paper the power cycling test results are evaluated with respect to failures
in the substrate solder. Those tests with their high number of cycles are utilize
infineon IGBT电源循环测试
本地下载

评论