资料介绍
infineon IGBT电源循环测试Reliability of Substrate Solder Joints from Power Cycling Tests
Thomas Hunger, Infineon Technologies AG, Warstein, Germany
Reinhold Bayerer, Infineon Technologies AG, Warstein, Germany
Abstract
The lifetime of the solder joint between base plate and ceramic substrate is usually tested by passively
heating and cooling the IGBT module (thermal cycling). This provokes failures (delamination) in that
solder layer. But, the IGBT and diode dies are actively heated in the application. Other failure modes
(e.g. bond wire lift off) are addressed and limit the lifetime. This kind of stress is usually tested via
power cycling. In the present paper the power cycling test results are evaluated with respect to failures
in the substrate solder. Those tests with their high number of cycles are utilize