infineon IGBT新型连接和装配技术

infineon IGBT新型连接和装配技术
New assembly and interconnects beyond sintering methods

Karsten Guth1, Dirk Siepe1, Jens Grlich1, Holger Torwesten2, Roman Roth2,
Frank Hille3, Frank Umbach3
1
Infineon Technologies AG, Max-Planck-Strae 5, 59581 Warstein, Germany
2
Infineon Technologies Austria AG, Siemensstrae 2, 9500 Villach, Austria
3
Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany
3

Abstract
Today, with IGBT power modules a point has been reached where the operation area and life-time is
limited by the standard packaging technologies, such as wire bonding and soft soldering. As a result, a
further optimisation of the used technologies wil