infineon IGBT新型装配技术应用于高电压

infineon IGBT新型装配技术应用于高电压
New superior assembly technologies for modules with highest
power densities
Dr. Roland Ott, Marco Bler, Roman Tschirbs, Dirk Siepe, Infineon Technologies AG, Germany




Abstract
Power module development is striving for higher power densities, not only in new but also in already
established packages. Two main challenges for such kinds of upgrades are to meet the increased
requirements towards ampacity and heat dissipation. These new requirements may enforce
adjustments in the utilized packaging technologies to overcome the given package limitations. The
current article investigates the challenges of increased power densities in existing module packages
and how they can be mastered.


1. Introduction
The continuous trend of IGBT chip optimization
[1], [2] enables IGBT power module deve