infineon IGBT自动压力FIT模块

infineon IGBT自动压力FIT模块
Self acting PressFIT module
Thilo Stolze

Infineon Technologies AG, Max-Planck-Strasse 5, 59581 Warstein




Abstract
Customers of power electronics require more and more new, easy connection and mounting technolo-
gies. The PressFIT technology offers the possibility of solderless mounting combined with an improved
reliability in comparison to soldering.
To continue this approach, a new module platform based on PressFIT technology has been developed
which furthermore offers an extremely fast and robust mounting concept to improve the manufacturing,
reliability and design of the inverters. Special focus has been put on mechanical robustness. Avoiding the
risk of DCB crack