infineon 新型电子电阻数据

infineon 新型电子电阻数据
Application Note

Date: 12.05.2004 Page 1
AN-Number: AN-2004-01 Department: SM TM


New RthCH data sheet values

With the release of a new data sheet software for IGBT modules in
2003 the ‘thermal resistance case to heat-sink per module’ is
supplemented by the therein included values for the ‘thermal
resistance case to heat-sink per IGBT’ and the ‘thermal resistance
case to heat-sink per diode’.

Previous specification:


New specification:




Due to the distribution of
separate chips for IGBT and
diode across the modules
surface (e.g. on the right you
find a view into an open
FZ600R65KF1 with 24 IGBT
chips (red) and 12 diode chips
(green)) the assumption of a
p