资料介绍
Packaging Modules - PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Technical Brief 488
Authors: Mark Kwoka and Loyde Carpenter
PCB Land Pattern Design and Surface Mount
Guidelines for POL Modules
Introduction Module QFN Package Outline
Intersil's POL Module Product family offering a relatively new Drawings
packaging concept that is currently experiencing rapid growth. Intersil’s individual product data sheets reference to the
This Module Product family features the QFN Package. The a
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