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关于intersil的再PC板上焊接表贴器件的指导方针

资料介绍
The most commonly used techniques for mounting SMDs
(Surface Mounted Devices) to PC boards are Infrared (IR) and
Vapor Phase (VP) reflow. IR and VP reflow are preferred over
wave soldering. Wave soldering typically involves increased
heating rate, higher temperatures and increased flux exposure.
If wave soldering is to be used as a reflow method,
Intersil must be contacted prior to use. (See Technical
Brief TB363, “Guidelines for Handling and Processing Moisture
Sensitive Surface Mount Devices (SMDs)).
TM
Guidelines for Soldering Surface
Mount Components to PC Boards
Technical Brief October 2000 TB334.2
Author: Maury Roseneld


Introduction glass transition temperature of the epoxy in FR-4 boards
The most commonly used techniques for mounting SMDs
关于intersil的再PC板上焊接表贴器件的指导方针
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