intersil的D28.6 — Mil-Std-1835 CDIP2-T28(D-10,Config C)28脚金锡盖双列直插封装管壳(SBDIP)封装

D28.6 — Mil-Std-1835 CDIP2-T28(D-10,Config C)28 Lead Ceramic Dual-In-Line Metal Seal PKG
Hermetic Packages for Integrated Circuits

Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1 LEAD FINISH D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C)
-A- -D- 28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE

BASE INCHES MILLIMETERS
(c)
METAL
E SYMBOL MIN