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首页 > 分享下载 > 嵌入式系统 > intersil的D24.3 — Mil-Std-1835 CDIP4-T24(D-9,Config C)24脚金锡盖双列直插封装管壳(SBDIP)封装

intersil的D24.3 — Mil-Std-1835 CDIP4-T24(D-9,Config C)24脚金锡盖双列直插封装管壳(SBDIP)封装

资料介绍
D24.3 — Mil-Std-1835 CDIP4-T24(D-9,Config C)24 Lead Ceramic Dual-In-Line Metal Seal PKG
Hermetic Packages for Integrated Circuits

Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1 LEAD FINISH D24.3 MIL-STD-1835 CDIP4-T24 (D-9, CONFIGURATION C)
-A- -D- 24 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE

BASE INCHES MILLIMETERS
(c)
METAL
E SYMBOL MIN
标签:intersilSBDIP
intersil的D24.3 — Mil-Std-1835 CDIP4-T24(D-9,Config C)24脚金锡盖双列直插封装管壳(SBDIP)封装
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