intersil的J44.A — Mil-Std-1835 CQCC1-N44 (C-5) 44焊盘带引脚的陶瓷芯片载体封装（CLCC）

J44.A — Mil-Std-1835 CQCC1-N44 (C-5) 44 Pad Ceramic Leadless Chip Carrier Package
Hermetic Packages for Integrated Circuits

Ceramic Leadless Chip Carrier Packages (CLCC)

0.010 S E H S
J44.A MIL-STD-1835 CQCC1-N44 (C-5)
44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
D
INCHES MILLIMETERS
D3
SYMBOL MIN MAX MIN MAX NOTES
j x 45o